The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2006
Filed:
Feb. 09, 2005
Hubert Benzel, Pliezhausen, DE;
Masoud Habibi, Schwieberdingen, DE;
Gilbert Moersch, Stuttgart, DE;
Roland Guenschel, Reutlingen, DE;
Jan Gebauer, Gerlingen, DE;
Hubert Benzel, Pliezhausen, DE;
Masoud Habibi, Schwieberdingen, DE;
Gilbert Moersch, Stuttgart, DE;
Roland Guenschel, Reutlingen, DE;
Jan Gebauer, Gerlingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A micromechanical device for measuring a pressure variable and a method for manufacturing a micromechanical pressure sensor. The sensor includes, two components; a first component featuring a diaphragm made of a first material, and a second component of a second material. This second component is designed to have a thin first region and a thick second region. The first and second components are permanently joined together via the first diaphragm and at least a portion of the first region. The materials are selected such that the temperature expansion coefficient of the first material is higher than that of the second material. The first and second components are joined in such a manner that a lateral expansion of the first diaphragm caused by temperature changes is transferred to the first region of the second component as a lateral expansion as well.