The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2006

Filed:

Feb. 19, 2002
Applicant:

Ikuhito Onodera, Tokyo, JP;

Inventor:

Ikuhito Onodera, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 5/40 (2006.01); G11B 5/127 (2006.01);
U.S. Cl.
CPC ...
Abstract

Leading wires of an electrical circuit and a thin film magnetic head assembly are electrically connected with a conductive film. The leading wires are connected to an element pad and a circuit pad, respectively. An element bump is shared with the electrical circuit and the thin film magnetic assembly. Information of the processing degree of the thin film magnetic head assembly is electrically monitored via the element bump from a bonding pad which is electrically connected with the element bump.


Find Patent Forward Citations

Loading…