The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2006

Filed:

Aug. 16, 2002
Applicants:

Ewald Schmidt, Ludwigsburg, DE;

Juergen Hasch, Stuttgart, DE;

Heinz Pfizenmaier, Murrhardt, DE;

Inventors:

Ewald Schmidt, Ludwigsburg, DE;

Juergen Hasch, Stuttgart, DE;

Heinz Pfizenmaier, Murrhardt, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/24 (2006.01); H01P 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a micromechanical resonator having a bondable resonance body and a method for fabricating a micromechanical resonator for semiconductor components. The invention provides that the resonator () is composed successively of a first layer () of silicon for coupling the resonator () in terms of a circuit, an insulating layer () of silicon dioxide, a cylindrical base layer (cylinder), and a metal layer () completely surrounding the cylinder (). The method provides that a cylindrical structure () (cylinder) is etched (trench etching process) in a base layer () of p-doped silicon (SOI wafer) separated from a layer () of silicon by an insulating layer (), and the cylindrical structure () is coated with a metal layer ().


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