The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2006

Filed:

Dec. 20, 2004
Applicants:

Baomin Xu, Cupertino, CA (US);

Steven A. Buhler, Sunnyvale, CA (US);

Michael C. Weisberg, Woodside, CA (US);

William S. Wong, San Carlos, CA (US);

Scott E. Solberg, Mountain View, CA (US);

Karl A. Littau, Palo Alto, CA (US);

John S. Fitch, Los Altos, CA (US);

Scott A. Elrod, La Honda, CA (US);

Inventors:

Baomin Xu, Cupertino, CA (US);

Steven A. Buhler, Sunnyvale, CA (US);

Michael C. Weisberg, Woodside, CA (US);

William S. Wong, San Carlos, CA (US);

Scott E. Solberg, Mountain View, CA (US);

Karl A. Littau, Palo Alto, CA (US);

John S. Fitch, Los Altos, CA (US);

Scott A. Elrod, La Honda, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A piezoelectric thick film element array includes at least one piezoelectric element structure having a thickness between 10 μm to 100 μm formed by a deposition process. The at least one piezoelectric element is patterned during the deposition process, and includes a first electrode deposited on a first surface of the piezoelectric elements structure, and a second electrode deposited on a second surface of the piezoelectric element structure. In a further embodiment, several devices are provided using a piezoelectric element or an array having a piezoelectric element structure with a thickness of between 10 μm to 100 μm formed by a deposition process. These devices include microfluidic ejectors, transducer arrays and catheters.


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