The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2006
Filed:
Jun. 07, 2002
Applicants:
Shinji Suminoe, Tenri, JP;
Hiroyuki Nakanishi, Nara, JP;
Toshiya Ishio, Nabari, JP;
Yoshihide Iwazaki, Tenri, JP;
Katsunobu Mori, Nara, JP;
Inventors:
Shinji Suminoe, Tenri, JP;
Hiroyuki Nakanishi, Nara, JP;
Toshiya Ishio, Nabari, JP;
Yoshihide Iwazaki, Tenri, JP;
Katsunobu Mori, Nara, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A leading wiring layer is provided with a main conductor layer, a first barrier metal layer for covering bottom and side surfaces of the main conductor layer, and a second barrier metal layer for covering a top surface of the main conductor layer. This ensures the respective barrier metal layers to cover entire surroundings including the side, bottom and top surfaces of the main conductor layer.