The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2006
Filed:
Oct. 15, 2004
Applicant:
Stefan Geyer, Dresden, DE;
Inventor:
Stefan Geyer, Dresden, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relates to a wafer level package for chips with chip edge protection, comprising individual chips, which can in each case be mounted on a suitable carrier board, and to a method for producing such a wafer level package. Aspects of the invention can be achieved by the chip being thinned extremely from the back side and bonded onto a fiber reinforced synthetic resin sheet, forming a solidly bonded assembly that cannot come apart in the customary temperature range, and the edges of the assembly being at least partly coated with a polymer.