The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2006
Filed:
Jun. 25, 2003
Applicants:
Takayuki Usami, Tokyo, JP;
Takao Hirai, Tokyo, JP;
Inventors:
Takayuki Usami, Tokyo, JP;
Takao Hirai, Tokyo, JP;
Assignee:
The Furukawa Electric, Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A high-mechanical strength copper alloy, which comprises Ni 1.0 to 4.5% by mass, Si 0.2 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of Cu and inevitable impurities, wherein the alloy has a tensile strength of 800 N/mmor more, and wherein the alloy has a stress relaxation ratio of 10% or less.
Usami, Takayuki. (2006). High-mechanical strength copper alloy (U.S. Patent No. 7090732). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7090732
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile