The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2006
Filed:
Nov. 30, 2004
Sung-pei Hou, Tu-Chen, TW;
Sung-Pei Hou, Tu-Chen, TW;
Hon Hai Precision Ind. Co., Ltd., Taipei Hsien, TW;
Abstract
A land grid array (LGA) socket is adapted to receive an IC module () and mounted on a PCB (). The socket () includes an insulative housing () having a plurality of passageways () and a plurality of electrical terminals () received in the passageways. Each of the terminals includes a retention portion (), a pressing arm () bent slantwise and extending upwardly from an end of the retention portion, and a contacting ann () bent slaniwise and extending downwardly from another end of the retention portion. At least one connecting plate () connects the pressing urn and the contacting arm, the connecting plate is separate from the retention portion, thereby decreasing impedance of the terminal.