The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2006

Filed:

Apr. 10, 2003
Applicants:

Tadahiro Kegasawa, Fujinomiya, JP;

Ryuichi Katsumoto, Fujinomiya, JP;

Masanori Takase, Fujinomiya, JP;

Yoshifumi Waki, Fujinomiya, JP;

Kunihiko Kikuchi, Fujinomiya, JP;

Inventors:

Tadahiro Kegasawa, Fujinomiya, JP;

Ryuichi Katsumoto, Fujinomiya, JP;

Masanori Takase, Fujinomiya, JP;

Yoshifumi Waki, Fujinomiya, JP;

Kunihiko Kikuchi, Fujinomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 47/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The manufacturing apparatus of a resin molded product has a feed block that sets a layer configuration of the resin molded product obtained by molding a plurality of molten resins. The feed block includes a feed block body having a through hole, and a plurality of replacement blocks that are removably fitted into the through hole and have layer configuring passages corresponding to different layer configurations. A replacement block before change is pushed out of the through hole by a replacement block having a layer configuring passage corresponding to a layer configuration after change, thereby changing the layer configuration. This allows an easy change of a layer configuration, and in particular, prevents degradation of resin due to heat or oxidation, and reduces time for the change and a material loss even when a significant change of the layer configuration such as a change of a layer arrangement is performed.


Find Patent Forward Citations

Loading…