The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2006
Filed:
Aug. 15, 2002
Alfredo Martin Morales, Pleasanton, CA (US);
Linda A. Domeier, Danville, CA (US);
Marcela G. Gonzales, Seattle, WA (US);
Patrick N. Keifer, Livermore, CA (US);
Terry Joseph Garino, Albuquerque, NM (US);
Alfredo Martin Morales, Pleasanton, CA (US);
Linda A. Domeier, Danville, CA (US);
Marcela G. Gonzales, Seattle, WA (US);
Patrick N. Keifer, Livermore, CA (US);
Terry Joseph Garino, Albuquerque, NM (US);
Sandia National Laboratories, Livermore, CA (US);
Abstract
A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.