The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2006

Filed:

May. 19, 2003
Applicants:

Leonid Akhtman, Shani, IL;

Sakaev Matvey, Arad, IL;

Inventors:

Leonid Akhtman, Shani, IL;

Sakaev Matvey, Arad, IL;

Assignee:

Vishay Intertechnology, Inc., Malvern, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides for a method for manufacturing flip chip resistors by applying a first electrode layer to a substrate to create at least one pair of opposite electrodes, applying a resistance layer between each pair of opposite electrodes, applying a first protective layer at least partially overlaying the resistance layer, applying a second protective layer at least partially overlaying at least a portion of the resistance layer, and applying a second electrode layer overlaying the first electrode layer, a portion of the resistance layer, and at least a portion of the second protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.


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