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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7089165 B1

PDFFull Text
Expired
Date of Patent:
Aug. 08, 2006

Filed:

Mar. 02, 2005

Method of offering wall-thickness thinning prediction information, and computer-readable recording medium storing wall-thickness thinning prediction program, and method of planning piping work plan

Applicants:

Kenji Araki, Mito, JP;

Masatoshi Takada, Hitachi, JP;

Masakazu Hisatsune, Hitachi, JP;

Satoru Aoike, Hitachi, JP;

Kenji Utaka, Hitachi, JP;

Masafumi Noujima, Hitachi, JP;

Chikara Takeuchi, Hitachi, JP;

Inventors:

Kenji Araki, Mito, JP;

Masatoshi Takada, Hitachi, JP;

Masakazu Hisatsune, Hitachi, JP;

Satoru Aoike, Hitachi, JP;

Kenji Utaka, Hitachi, JP;

Masafumi Noujima, Hitachi, JP;

Chikara Takeuchi, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:

Mattingly, Stanger, Malur & Brundidge, P.C.

Primary Examiner:

Russell Frejd

Int. Cl.
CPC ...
G06G 7/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wall-thickness thinning rate at a not-measured position is estimated using information having a small number of measured points. Simulation of behavior of fluid flowing inside a pipe line is performed based on wall-thickness data of pips and three-dimensional layout data of the pipe line including the pips using a computer, and simulated wall-thickness thinned data of the pipes composing the pipe line is calculated from change of the simulated behavior of fluid.

Find Patent Forward Citations

Araki, Kenji. (2006). Method of offering wall-thickness thinning prediction information, and computer-readable recording medium storing wall-thickness thinning prediction program, and method of planning piping work plan (U.S. Patent No. 7089165). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7089165

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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