The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
Mar. 02, 2005
Kenji Araki, Mito, JP;
Masatoshi Takada, Hitachi, JP;
Masakazu Hisatsune, Hitachi, JP;
Satoru Aoike, Hitachi, JP;
Kenji Utaka, Hitachi, JP;
Masafumi Noujima, Hitachi, JP;
Chikara Takeuchi, Hitachi, JP;
Kenji Araki, Mito, JP;
Masatoshi Takada, Hitachi, JP;
Masakazu Hisatsune, Hitachi, JP;
Satoru Aoike, Hitachi, JP;
Kenji Utaka, Hitachi, JP;
Masafumi Noujima, Hitachi, JP;
Chikara Takeuchi, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A wall-thickness thinning rate at a not-measured position is estimated using information having a small number of measured points. Simulation of behavior of fluid flowing inside a pipe line is performed based on wall-thickness data of pips and three-dimensional layout data of the pipe line including the pips using a computer, and simulated wall-thickness thinned data of the pipes composing the pipe line is calculated from change of the simulated behavior of fluid.