The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7087664 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 08, 2006

Filed:

Jan. 23, 2004
Applicants:

Toshiaki Hayashi, Tsukuba, JP;

Katsuhiro Furuta, Tsukuba, JP;

Inventors:

Toshiaki Hayashi, Tsukuba, JP;

Katsuhiro Furuta, Tsukuba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/36 (2006.01); C08L 63/00 (2006.01); C08L 81/06 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.


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Hayashi, Toshiaki. (2006). Resin film and multilayer printed wiring board using thereof (U.S. Patent No. 7087664). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7087664

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