The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
Jul. 13, 2005
Atsuo Hattori, Iwata, JP;
Toshitaka Yoshino, Hamamatsu, JP;
Tetsutsugu Hamano, Shizuoka-ken, JP;
Masahiro Sugiura, Hamamatsu, JP;
Atsuo Hattori, Iwata, JP;
Toshitaka Yoshino, Hamamatsu, JP;
Tetsutsugu Hamano, Shizuoka-ken, JP;
Masahiro Sugiura, Hamamatsu, JP;
Yamaichi Electronics, Co., Ltd., Tokyo, JP;
Abstract
A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.