The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2006

Filed:

Feb. 25, 2005
Applicants:

John Mark Myer, Millersville, PA (US);

Craig Maurice Campbell, Camp Hill, PA (US);

Charles Randall Malstrom, Lebanon, PA (US);

Daniel Williams Fry, Jr., Elizabethtown, PA (US);

Hurley Chester Moll, Harrisburg, PA (US);

Inventors:

John Mark Myer, Millersville, PA (US);

Craig Maurice Campbell, Camp Hill, PA (US);

Charles Randall Malstrom, Lebanon, PA (US);

Daniel Williams Fry, Jr., Elizabethtown, PA (US);

Hurley Chester Moll, Harrisburg, PA (US);

Assignee:

Tyco Electronics Corporation, Middletown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/02 (2006.01); H01R 12/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A header assembly includes an insulative housing having a plurality of walls defining an interior cavity extending along a mating axis, and a plurality of contacts within the cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulative housing includes at least one alignment rib extending on an exterior surface thereof in a direction substantially perpendicular to the mating axis. The contacts are formed against and abutting the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.


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