The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
Jul. 29, 2003
Wei-liang Chen, Taoyuan Hsien, TW;
Wei-ming Wu, HsinChu Hsien, TW;
Wei-Liang Chen, Taoyuan Hsien, TW;
Wei-Ming Wu, HsinChu Hsien, TW;
Uniwill Computer Corp., Chungli, TW;
Abstract
A heat sink module includes a heat dissipation pad. The heat dissipation pad is flexible and has a cambered shape, and is pressed to become a flat plate when disposed between the heat sink module and a CPU. The heat dissipation pad restores to its original cumbered shape and lifts the heat sink module away from a CPU when a fixing device that fixes the heat sink module to the CPU is disabled. Therefore, one can easily removes the heat sink module without any additional tools or processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile