The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2006

Filed:

Jun. 23, 2003
Applicants:

Atsushi Ito, Owariasahi, JP;

Tsuyoshi Eguchi, Nagoya, JP;

Toshiya Matsuyama, Tajimi, JP;

Yasunori Kobayashi, Gifu, JP;

Yumiko Ohashi, Hashima, JP;

Inventors:

Atsushi Ito, Owariasahi, JP;

Tsuyoshi Eguchi, Nagoya, JP;

Toshiya Matsuyama, Tajimi, JP;

Yasunori Kobayashi, Gifu, JP;

Yumiko Ohashi, Hashima, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 53/00 (2006.01); G01D 15/00 (2006.01); G11B 5/27 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process of manufacturing a nozzle plate for an ink-jet print head. The nozzle plate includes (a) a substrate having an outside surface which is to be opposed to a print media, an inside surface which is opposite to the outside surface and nozzle holes which are formed through the substrate so as to be open in the outside and inside surfaces, and (b) a non-wetting layer which has a non-wetting characteristic and which covers the outside surface of the substrate. The manufacturing process includes: (i) a masking step of applying a resist on the inside surface of the substrate, and charging the nozzle holes with the insulating material such that portions of the resist protrude outwardly from openings of the nozzle holes on the outside surface; (ii) a non-wetting-layer forming step of forming the non-wetting layer on the outside surface in a plating operation; and (iii) an unmasking step of removing the resist from the substrate.


Find Patent Forward Citations

Loading…