The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2006

Filed:

May. 19, 2003
Applicants:

Steven Sui Hung Chu, Milpitas, CA (US);

Wen-ong Wu, Hsinchu, TW;

Chee Tong Lau, Taoyuen, TW;

Inventors:

Steven Sui Hung Chu, Milpitas, CA (US);

Wen-Ong Wu, Hsinchu, TW;

Chee Tong Lau, Taoyuen, TW;

Assignee:

Analog Microelectronics, Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 27/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of efficiently and accurately heating a semiconductor device in a standard (i.e. room temperature) handler are provided. In one embodiment, an infrared light source can be focused on the device to heat its chip. In another embodiment, the substrate diode in the device can be forward biased to heat the chip. Advantageously, the forward voltage of the substrate diode has a direct relationship with chip temperature. This relationship can be determined based on a characterization of an exemplary device type. Therefore, measuring the forward voltage can provide an accurate derivation of chip temperature. Heating of the device using a focused light source or substrate diode can be done immediately prior to testing, thereby providing an extremely time efficient way to test the device under high temperature conditions.


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