The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2006
Filed:
Jun. 21, 2004
Richard C. Chu, Hopewell Junction, NY (US);
Michael J. Ellsworth, Jr., Lagrangeville, NY (US);
Egidio E. Marotta, College Station, TX (US);
Prabjit Singh, Poughkeepsie, NY (US);
Richard C. Chu, Hopewell Junction, NY (US);
Michael J. Ellsworth, Jr., Lagrangeville, NY (US);
Egidio E. Marotta, College Station, TX (US);
Prabjit Singh, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.