The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2006
Filed:
Nov. 20, 2002
Takaaki Higashida, Kadoma, JP;
Takafumi Okuma, Hirakata, JP;
Daisuke Suetsugu, Uji, JP;
Seiji Nakashima, Okasa, JP;
Kenichi Yamamoto, Moriguchi, JP;
Munekazu Nishihara, Neyagawa, JP;
Kenichi Sato, Ikoma, JP;
Takaaki Higashida, Kadoma, JP;
Takafumi Okuma, Hirakata, JP;
Daisuke Suetsugu, Uji, JP;
Seiji Nakashima, Okasa, JP;
Kenichi Yamamoto, Moriguchi, JP;
Munekazu Nishihara, Neyagawa, JP;
Kenichi Sato, Ikoma, JP;
Matsushita Electric Industrial Co., Ltd., Osaka-fu, JP;
Abstract
A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.