The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2006
Filed:
Mar. 27, 2002
Shuichi Matsuda, Minato-Ku, JP;
Shuichi Matsuda, Minato-Ku, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also restrains the occurrence of disconnection caused by a wiring layer being crushed. In the semiconductor device, the sealing resin for sealing the semiconductor chip is molded on the circuit board that has a plurality of wiring patterns and a solder resist for insulatively covering the wiring patterns formed on the front surface thereof, the interval of the wiring patterns is set to range from 50% to 200% of its adjacent interval in a molding line area of the sealing resin.