The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2006

Filed:

Jun. 17, 2003
Applicant:

William C. Schuh, Delavan, WI (US);

Inventor:

William C. Schuh, Delavan, WI (US);

Assignee:

Watlow Electric Manufacturing Co., St. Louis, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/02 (2006.01); H01L 35/04 (2006.01); H01L 35/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus and system is presented for partially compensating the cold junction of a thermocouple system using low cost semi-compensated conductors of system components accommodating various thermocouple types. The thermocouple system, comprises a thermocouple portion comprising two thermocouple types, each type composed of two different thermoelectric materials joined to form a hot junction, a semi-compensation portion comprising two substantially similar conductor pairs, each composed of a different material, wherein one conductor of each pair is composed of a material different than the thermoelectric materials of the respective thermocouple type of the thermocouple portion. The thermocouple system further comprises a cold junction compensation portion comprising at least two cold junction conductors composed of the same material, and wherein at least one conductor is composed of a different material than the conductor pairs of the semi-compensation portion, and a cold junction formed by the connection of the semi-compensation portion conductor pairs and the cold junction conductors. The conductors of the semi-compensation portion also engage with the thermoelectric materials of the thermocouple portion to provide an electrical interconnection therebetween, and to provide a partial compensation to the EMF developed at the cold junction of the respective thermocouple.


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