The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7084098 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 01, 2006

Filed:

Jan. 15, 2004
Applicants:

Bum-young Myoung, Seoul, KR;

Byoung-ho Rhee, Dacjeon, KR;

Yang-je Lee, Chungchungbuk-do, KR;

Dek-gin Yang, Chungchungbuk-do, KR;

Inventors:

Bum-Young Myoung, Seoul, KR;

Byoung-Ho Rhee, Dacjeon, KR;

Yang-Je Lee, Chungchungbuk-do, KR;

Dek-Gin Yang, Chungchungbuk-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 7/32 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed herein are a brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface, and a method for improving adhesion of a polyimide surface by applying the composition to a brown oxide process. The brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface comprises, 5˜15 g/L of an amine; 190˜210 g/L of a hydroxide compound; at least one additive selected from 3˜6 g/L of a cleaner adjuvant, 0.1˜5 g/L of a antifoaming agent and 1˜10 g/L of a precipitation inhibitor; and the balance of water. When the brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface is applied to a pretreatment step of a brown oxide process, it can clean a copper surface and improve adhesion of a polyimide surface.


Find Patent Forward Citations

Myoung, Bum-Young. (2006). Brown oxide pretreatment composition for cleaning copper surface and improving adhesion of polyimide surface, and method for improving adhesion of polyimide surface by applying the same to brown oxide process (U.S. Patent No. 7084098). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7084098

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