The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2006

Filed:

Nov. 30, 2001
Applicant:

Naokatsu Ikegami, Saitama, JP;

Inventor:

Naokatsu Ikegami, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

Abstract of the Disclosure A method for manufacturing a semiconductor device including a conductive path extending from the upper surface of an insulating layer on a semiconductor substrate to a conductive member embedded in the insulating layer. An etching mask, which defines an etched hole for the conductor path, is formed on the insulating layer within a specified permissible error, and that portion of the insulating layer which is not covered by the etching mask is removed by a reactive ion etching unit having a reaction chamber into which a reactive gas of CHF/CO is introduced at a CHF/CO flow ratio of about 15/85. After this, the etched hole formed by an etching process is filled with a conductive material for the conductive path.


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