The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2006
Filed:
Jul. 26, 2003
Dag Behammer, Ulm, DE;
Dag Behammer, Ulm, DE;
United Monolithic Semiconductors GmbH, Ulm, DE;
Abstract
A method for the production of individual integrated circuit arrangements from a wafer composite is disclosed, whereby the wafer is fixed with the component side (FS) on a support, the individual circuit arrangements () are separated on the support body by the etching of separating trenches () and individually lifted from the support body. The semiconductor substrate () is reduced in thickness during the fixing of the wafer to the support body, preferably to a substrate thickness of less than 100 μm. A reverse face metallization () is deposited on the back face (RS) of the thinned substrate, preferably after separation of the circuit arrangements on the support body.