The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7083751 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 01, 2006

Filed:

Mar. 25, 2003
Applicant:

Shouji Yamazaki, Wako, JP;

Inventor:

Shouji Yamazaki, Wako, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 44/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for forming a solidified granular material (), in which granules () are charged into a tubular frame member () and then heated together with the frame member, to solidify the granules. The granules include a mixture of first granules () and second granules (), each of which second granules has a thermoplastic resin shell enclosing a solid or liquid which expands by vaporization. The mixture is charged into the frame member and heated together with the frame member. The heating causes the second granules () to expand and the surfaces of the second granules to melt for bonding with the first granules (). The mixture, upon cooling, becomes a solidified granular material (), filling the frame member with no space therebetween.


Find Patent Forward Citations

Yamazaki, Shouji. (2006). Method for forming solidified granular materials (U.S. Patent No. 7083751). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7083751

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…