The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2006
Filed:
Oct. 30, 2002
Adam Jude Ahne, Lexington, KY (US);
John Douglas Anderson, Lexington, KY (US);
Stephen Andrew Budelsky, Lexington, KY (US);
Mark Joseph Edwards, Lexington, KY (US);
Randall David Mayo, Georgetown, KY (US);
George Keith Parish, Winchester, KY (US);
Kristi Maggard Rowe, Richmond, KY (US);
David Craig Stevenson, Lexington, KY (US);
Adam Jude Ahne, Lexington, KY (US);
John Douglas Anderson, Lexington, KY (US);
Stephen Andrew Budelsky, Lexington, KY (US);
Mark Joseph Edwards, Lexington, KY (US);
Randall David Mayo, Georgetown, KY (US);
George Keith Parish, Winchester, KY (US);
Kristi Maggard Rowe, Richmond, KY (US);
David Craig Stevenson, Lexington, KY (US);
Lexmark International, Inc., Lexington, KY (US);
Abstract
A micro-miniature fluid ejecting device. The fluid ejecting device includes a semiconductor substrate having fluid ejectors formed on a surface of the substrate. A flexible circuit is fixedly attached to the semiconductor substrate. The flexible circuit has power contacts for providing power to the fluid ejectors. At least one drive circuit is connected to the fluid ejectors. The drive circuit is disposed on one of the semiconductor substrate and the flexible circuit. A fluid sequencer is connected to the drive circuit for selectively activating the fluid ejectors. The fluid sequencer is also disposed on one of the semiconductor substrate and the flexible circuit. The semiconductor substrate is attached to a housing. A fluid source is provided for supplying fluid to the semiconductor substrate for ejection by the fluid ejectors. The fluid ejecting device provides low cost construction for application specific miniature fluid jetting devices.