The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2006
Filed:
Apr. 18, 2003
Takehiro Suzuki, Nara, JP;
Takehiro Suzuki, Nara, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
By having substantially narrow pitches between wires in a first wiring layer located in an interlayer insulating layer of a semiconductor integrated circuit device, a total amount of the first wiring layer in the interlayer insulating film may be increased, thereby reducing a total amount of the interlayer insulating film having low hardness, which causes warping. As a result, stresses that are typically applied on a protective film of the semiconductor integrated circuit device due to the warping may be prevented. This may prevent the occurrence of a crack, etc. in the protective film. Therefore, it may be possible to prevent failures such as electrical disconnection of a second wiring layer above the protective film due to the crack in the protective film.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile