The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2006

Filed:

Mar. 21, 2003
Applicants:

Masayoshi Yamashita, Hamamatsu, JP;

Naoki Kamimura, Hamamatsu, JP;

Fumiyasu Tanoue, Hamamatsu, JP;

Katsuhiko Onoue, Hamamatsu, JP;

Toshiharu Hoshi, Iwata-gun, JP;

Inventors:

Masayoshi Yamashita, Hamamatsu, JP;

Naoki Kamimura, Hamamatsu, JP;

Fumiyasu Tanoue, Hamamatsu, JP;

Katsuhiko Onoue, Hamamatsu, JP;

Toshiharu Hoshi, Iwata-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thermoelectric module is constituted by a pair of substrates having electrodes, which are arranged opposite to each other with a prescribed space therebetween, in which a prescribed number of thermoelectric elements are arranged in such a way that a p-type and an n-type are alternately arranged, so that the thermoelectric elements are connected in series or in parallel together with the electrodes. Herein, one substrate is a heat absorption side, and other substrate is a heat radiation side. In addition, a current density in a current transmission area of the heat-absorption-side electrode is set to 50 A/mmor less, and a height of the thermoelectric element is set to 0.7 mm or less. Furthermore, a temperature-controlled semiconductor module can be realized by combining a thermoelectric module with a semiconductor component such as a semiconductor laser.


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