The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2006
Filed:
Aug. 13, 2002
Masakazu Fukada, Tokyo, JP;
Dai Nakajima, Tokyo, JP;
Ken Takanashi, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
In a power module (), a free-wheeling diode (A), an IGBT (B), and a capacitor () for smoothing direct current are disposed directly on a surface (BS) of a conductive heat sink (B) with through holes (BH). The rear electrodes of the free wheeling diode (A), the IGBT (B), and the capacitor () are bonded to the heat sink (B) for example with solder, whereby the diode (A), the IGBT (B), and the capacitor () are electrically connected with the heat sink (B). The front electrodes of the diode (A), the IGBT (B), and the capacitor () are connected with each other for example by wires (). In the heat sink (B), a cooling medium flows through the through holes (BH). Such a configuration allows miniaturization of the power module and improves the cooling performance and reliability of the power module.