The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2006
Filed:
Sep. 24, 2004
Applicant:
Shawn X. Du, Macedonia, OH (US);
Inventor:
Shawn X. Du, Macedonia, OH (US);
Assignee:
GELcore, LLC, Valley View, OH (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a chip package (), first and second electrical power buses () are each formed of an electrical conductor having a chip bonding portion () and a lead portion () extending away from the chip bonding portion. The chip bonding portions of the first and second electrical power buses have edges () spaced apart from one another to define an extended electrical isolation gap (). A plurality of chips () straddle the extended electrical isolation gap and are electrically connected with the first and second electrical power buses to receive electrical power from the first and second electrical power buses.