The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2006
Filed:
Aug. 06, 2002
Toshihide Sekido, Otsu, JP;
Akihiko Kitano, Matsuyama, JP;
Eisuke Wadahara, Iyo-gun, JP;
Fumiaki Noma, Matsuyama, JP;
Toshihide Sekido, Otsu, JP;
Akihiko Kitano, Matsuyama, JP;
Eisuke Wadahara, Iyo-gun, JP;
Fumiaki Noma, Matsuyama, JP;
Toray Industries, Inc., , JP;
Abstract
This invention relates to a method for manufacturing a large FRP member including: disposing a preform containing a reinforcing fiber on a surface of a molding die; covering a molding portion with a bagging material or a mold and providing a suction port and a resin injection port for sealing; evacuating the molding portion through the suction port; heating the molding portion; injecting a thermosetting resin from the resin injection port for impregnating the reinforcing fiber with the resin while a temperature Tm of the molding die and a temperature Tv of the bagging material or the mold are both set to room temperature or more, and a difference ΔT in temperature between the Tm and the Tv is set to 10° C. or less; and curing the resin by maintaining the molding portion at a predetermined temperature Tpc which is equal to or more than room temperature.