The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2006

Filed:

Nov. 26, 2003
Applicants:

Kazuhisa Saito, Tokyo, JP;

Asuka Hosoda, Tokyo, JP;

Hiroshi Akimoto, Tokyo, JP;

Inventors:

Kazuhisa Saito, Tokyo, JP;

Asuka Hosoda, Tokyo, JP;

Hiroshi Akimoto, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing an electronic component with a contact having a terminal section for brazing and a contact section includes steps that construct a contact base member of a material that is poorly wettable, forms a primer plating layer of a material that is poorly wettable to the weld brazing material on the base member, forms a finish plating layer of a material that is highly wettable to the weld brazing material on the primer plating layer, and selectively removes a portion of the finish plating layer to obtain an exposed region of the primer plating layer that serves as an arresting region for arresting the weld brazing material from creeping up and migrating along the highly wettable finish plating layer in brazing the terminal section to the brazing pad of a wiring board.


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