The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2006
Filed:
Jul. 05, 2001
Tadatomo Suga, Tokyo 153-0041, JP;
Tadatomo Suga, Tokyo 153-0041, JP;
Other;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
There are provided a semiconductor device and method for fabricating the device capable of achieving reliable electrical connection by securely directly bonding conductors to each other even though bonding surfaces are polished by a CMP method and solid-state-bonded to each other. By polishing according to the CMP method, a through hole conductorand a grounding wiring layer, which are made of copper, become concave in a dish-like shape and lowered in level, causing a dishing portionsince they have a hardness lower than that of a through hole insulatormade of silicon nitride. The through hole insulatoris selectively etched by a reactive ion etching method until the through hole insulatorcomes to have a height equal to the height of a bottom portionof the dishing portionof the through hole conductor. The through hole conductorsandare aligned with each other, and the bonding surfacesandare bonded to each other in a solid state bonding manner.