The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2006

Filed:

Mar. 03, 2004
Applicants:

Akira Maeda, Tokyo, JP;

Takeyuki Maegawa, Tokyo, JP;

Shigeru Matsuno, Tokyo, JP;

Takuo Ozawa, Tokyo, JP;

Takanori Sone, Tokyo, JP;

Shoji Miyashita, Tokyo, JP;

Yasumichi Hatanaka, Tokyo, JP;

Masato Koyama, Tokyo, JP;

Takahiro Nagamine, Tokyo, JP;

Susumu Arai, Tokyo, JP;

Inventors:

Akira Maeda, Tokyo, JP;

Takeyuki Maegawa, Tokyo, JP;

Shigeru Matsuno, Tokyo, JP;

Takuo Ozawa, Tokyo, JP;

Takanori Sone, Tokyo, JP;

Shoji Miyashita, Tokyo, JP;

Yasumichi Hatanaka, Tokyo, JP;

Masato Koyama, Tokyo, JP;

Takahiro Nagamine, Tokyo, JP;

Susumu Arai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A metal electrode is formed on a substrate. The metal electrode includes a first layer, a second layer, and a third layer lying, from an outermost surface of the metal electrode toward the substrate, in this order. The first layer contains tin as a principal constituent and the second layer contains a metallic element which produces an eutectic reaction with tin, wherein the melting point of the first layer is higher than the melting point of the second layer. The third layer is an underlying metallic layer for the first and second layers.


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