The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2006

Filed:

Jul. 02, 2003
Applicants:

Ming-cheng Chang, Tao-Yuan Hsien, TW;

Tieh-chiang Wu, I-Lan Hsien, TW;

Yinan Chen, Taipei, TW;

Inventors:

Ming-Cheng Chang, Tao-Yuan Hsien, TW;

Tieh-Chiang Wu, I-Lan Hsien, TW;

Yinan Chen, Taipei, TW;

Assignee:

Nanya Technology Corp., Tao-Yuan Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/38 (2006.01); H01L 21/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a method for eliminating inverse narrow width effects in the fabrication of DRAM devices. A semiconductor substrate is provided having thereon a shallow trench. The shallow trench surrounds an active area. A non-doped silicate glass (NSG) layer is deposited to fill the shallow trench, and is then etched back to a depth of the shallow trench, thereby exposing a portion of the semiconductor substrate at an upper portion of the shallow trench. A doped dielectric layer is deposited over the remaining NSG layer to cover the exposed semiconductor substrate. A thermal process is then carried out to diffuse dopants of the doped dielectric layer into the semiconductor substrate, thereby forming a doped region at the periphery of the active area in a channel width direction.


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