The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2006
Filed:
Oct. 22, 2004
Emilio Camerlenghi, Bergamo, IT;
Alfonso Maurelli, Sulbiate, IT;
Daniela Peschiaroli, Milan, IT;
Paola Zabberoni, Monza, IT;
Emilio Camerlenghi, Bergamo, IT;
Alfonso Maurelli, Sulbiate, IT;
Daniela Peschiaroli, Milan, IT;
Paola Zabberoni, Monza, IT;
STMicroelectonics S.r.l., Agrate Brianza, IT;
Abstract
A method for sealing electronic devices formed on a semiconductor substrate includes forming at least one first conductive layer on a first portion of the semiconductor substrate for defining electronic devices, and forming a second conductive layer on a second portion of semiconductor substrate for also defining electronic devices. First regions are formed in the at least one first conductive layer for defining electronic devices, and a first sealing layer is formed on the whole semiconductor substrate to seal the first regions. Second regions are formed in the second conductive layer for defining electronic devices, and a second sealing layer is formed on the whole semiconductor substrate to seal the second regions.