The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2006
Filed:
Sep. 25, 2003
Nicholas I. Buchan, San Jose, CA (US);
Michael W. Chaw, San Jose, CA (US);
Sean Clemenza, San Jose, CA (US);
Dan Dawson, San Jose, CA (US);
Craig Hawker, Los Gatos, CA (US);
James L. Hedrick, Pleasanton, CA (US);
Wesley L. Hillman, Morgan Hill, CA (US);
Teddie P. Magbitang, Sunnyvale, CA (US);
Willi Volksen, San Jose, CA (US);
Dennis Mckean, Milpitas, CA (US);
Robert D. Miller, San Jose, CA (US);
Nicholas I. Buchan, San Jose, CA (US);
Michael W. Chaw, San Jose, CA (US);
Sean Clemenza, San Jose, CA (US);
Dan Dawson, San Jose, CA (US);
Craig Hawker, Los Gatos, CA (US);
James L. Hedrick, Pleasanton, CA (US);
Wesley L. Hillman, Morgan Hill, CA (US);
Teddie P. Magbitang, Sunnyvale, CA (US);
Willi Volksen, San Jose, CA (US);
Dennis McKean, Milpitas, CA (US);
Robert D. Miller, San Jose, CA (US);
Hitachi Global Storage Netherlands, B.V., Amsterdam, NL;
Abstract
A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant. The solid encapsulant is comprised of a polymer prepared by polymerizing a mixture of first and second monomers in a nonstoichiometric ratio effective to render the encapsulant debondable. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.