The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2006

Filed:

Feb. 28, 2002
Applicants:

Hikaru Kouta, Minato-ku, JP;

Mikio Oda, Minato-ku, JP;

Tadahiko Hanada, Minato-ku, JP;

Taro Kaneko, Minato-ku, JP;

Yutaka Urino, Minato-ku, JP;

Inventors:

Hikaru Kouta, Minato-ku, JP;

Mikio Oda, Minato-ku, JP;

Tadahiko Hanada, Minato-ku, JP;

Taro Kaneko, Minato-ku, JP;

Yutaka Urino, Minato-ku, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01L 21/00 (2006.01); B29P 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a device and a method for monitoring each of the propagated light beams that are propagated in each waveguide of an arrayed waveguide device and a method of fabricating the device. In the prior art, problems were encountered in deriving monitor light and photodetecting the derived monitor light within the waveguide substrate. In the present invention, waveguide directional couplers are formed in the spaces between the arrayed waveguides to derive a portion of the propagated light as monitor light. Cavities are provided at the ends of auxiliary waveguides connected to the directional couplers, and monitor light is guideded into these cavities. The monitor light, after being reflected upward or downward of the substrate by optical path conversion elements installed inside the cavities, is photodetected by photodiodes. The optical path conversion elements can be fabricated by inserting metal bumps into the cavities and then forming the bumps with a mold.


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