The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2006
Filed:
Apr. 22, 2004
Tauseef Kazi, San Diego, CA (US);
Jeff Gemar, San Diego, CA (US);
Vaishnav Srinivas, San Diego, CA (US);
Vivek Mohan, San Diego, CA (US);
Tauseef Kazi, San Diego, CA (US);
Jeff Gemar, San Diego, CA (US);
Vaishnav Srinivas, San Diego, CA (US);
Vivek Mohan, San Diego, CA (US);
Abstract
A main die and a stacked die are included in the same component package. A transmission gate () is implemented on the main die, and can be enabled to receive leakage current in a connection () between the main die and the stacked die, and to conduct the leakage current to a bonding pad () that is accessible external to the package. Thus, the connectivity between the main die and the stacked die can be tested after the dies are packaged. The transmission gate is disabled during high-speed testing and normal operation. The package can also include a multiplexer () that is enabled during high-speed testing to input and output test signals at the package level. A direction signal is used to indicate whether test signals are being input to or output from the main die.