The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2006

Filed:

May. 03, 2004
Applicants:

Gobi R. Padmanabhan, Sunnyvale, CA (US);

Visvamohan Yegnashankaran, Redwood City, CA (US);

Inventors:

Gobi R. Padmanabhan, Sunnyvale, CA (US);

Visvamohan Yegnashankaran, Redwood City, CA (US);

Assignee:

National Semiconductor Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/112 (2006.01);
U.S. Cl.
CPC ...
Abstract

Thermal hot spots in the substrate of a semiconductor die, and the required surface area of the semiconductor die, are substantially reduced by forming thermal or thermal and electrical pipes in the substrate that extend from a bottom surface of the substrate to a point near the top surface of the substrate.


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