The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2006
Filed:
May. 06, 2004
Wei-jung Chen, Hsinchu, TW;
Yung-ching Chang, Hsinchu, TW;
Jaw-shin Huang, Hsinchu, TW;
Cheng-yu Fang, Hsinchu, TW;
Chien-peng Yu, Hsinchu, TW;
Wei-Jung Chen, Hsinchu, TW;
Yung-Ching Chang, Hsinchu, TW;
Jaw-Shin Huang, Hsinchu, TW;
Cheng-Yu Fang, Hsinchu, TW;
Chien-Peng Yu, Hsinchu, TW;
Advanced Analog Technology, Inc, Hsinchu, TW;
Abstract
A semiconductor wafer includes a wafer body, a plurality of analog IC dies spacedly and alignedly formed on the wafer body to define a scribe line as a margin formed between each two dies wherein each of the dies has an internal circuit formed therewithin and at least a terminal pad formed along the scribe line, and a conductive arrangement including at least a conductive element formed on the wafer body to electrically connect the terminal pad with the internal circuit of the die in such a manner that when the die is cut off from the wafer body along the scribe line, the terminal pad is cut off from the die so as to keep the internal circuit in the die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile