The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2006

Filed:

Aug. 23, 2004
Applicant:

Bernhard P. Lange, Garland, TX (US);

Inventor:

Bernhard P. Lange, Garland, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead frame die pad.


Find Patent Forward Citations

Lange, Bernhard. (2006). Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages (U.S. Patent No. 7074653). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7074653

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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