The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2006

Filed:

Jul. 07, 2003
Applicants:

Norman L. Owens, Sun Lakes, AZ (US);

Darrel Frear, Phoenix, AZ (US);

Inventors:

Norman L. Owens, Sun Lakes, AZ (US);

Darrel Frear, Phoenix, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment of the invention, a semiconductor component includes: a leadframe () having a surface (); an integrated passive component () located above the surface of the leadframe; a semiconductor chip () electrically coupled to the integrated passive component and located above the surface of the leadframe; and a mold compound () disposed around the semiconductor chip, the integrated passive component, and the leadframe. A portion () of the leadframe is exposed outside of the mold compound. The integrated passive component comprises a passive device (). A direction () perpendicular to the surface of the leadframe is a vertical direction, and the semiconductor chip, the integrated passive component, and the leadframe are arranged vertically with respect to each other.


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