The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2006

Filed:

May. 28, 2002
Applicants:

Robert W. Berner, Kalispell, MT (US);

Daniel J. Woodruff, Kalispell, MT (US);

Wayne J. Schmidt, Kalispell, MT (US);

Kevin W. Coyle, Kalispell, MT (US);

Vladimir Zila, Carbough, CA;

Worm Lund, Bellevue, WA (US);

Inventors:

Robert W. Berner, Kalispell, MT (US);

Daniel J. Woodruff, Kalispell, MT (US);

Wayne J. Schmidt, Kalispell, MT (US);

Kevin W. Coyle, Kalispell, MT (US);

Vladimir Zila, Carbough, CA;

Worm Lund, Bellevue, WA (US);

Assignee:

Semitool, Inc., Kalispell, MT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/64 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.


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