The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2006
Filed:
Feb. 28, 2003
Robert Madge, Portland, OR (US);
Vijayashanker Rajagopalan, Fairview, OR (US);
Robert Madge, Portland, OR (US);
Vijayashanker Rajagopalan, Fairview, OR (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A method of testing integrated circuits. Each of the integrated circuits is tested with a first test at a first level of testing at a preceding testing step in a fabrication cycle of the integrated circuits to produce first test results associated with a first characteristic of the integrated circuits. The first test results are recorded with associated integrated circuit identification information. The integrated circuits are logically subdivided into bins based at least in part on the associated integrated circuit identification information. A defectivity value is calculated for each bin of subdivided integrated circuits based at least in part on the first test results recorded with the associated integrated circuit identification information. The integrated circuits within each of the bins are tested with a second test at a second level of testing at a succeeding testing step in the fabrication cycle of the integrated circuits to produce second test results associated with a second characteristic of the integrated circuits. The second characteristic is related to the first characteristic and the second level of testing is varied from bin to bin based at least in part on the defectivity value for the bin being tested.