The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2006

Filed:

Apr. 19, 2002
Applicants:

Takuhei Ohta, Chiba, JP;

Katsufumi Hiraishi, Chiba, JP;

Taeko Takarabe, Chiba, JP;

Syuji Takiyama, Chiba, JP;

Eri Kabemura, Chiba, JP;

Kazuya Miyamoto, Chiba, JP;

Takashi Matsuda, Chiba, JP;

Tazo Sawamura, Chiba, JP;

Inventors:

Takuhei Ohta, Chiba, JP;

Katsufumi Hiraishi, Chiba, JP;

Taeko Takarabe, Chiba, JP;

Syuji Takiyama, Chiba, JP;

Eri Kabemura, Chiba, JP;

Kazuya Miyamoto, Chiba, JP;

Takashi Matsuda, Chiba, JP;

Tazo Sawamura, Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/06 (2006.01); C08G 73/10 (2006.01); C08G 69/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol % or more of 4,4'-diamino-2,2′-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol % or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bis[4-(4-aminophenoxy)phenyl]propane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid.


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