The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2006
Filed:
Jun. 17, 2003
Iwao Nohara, Nakatsugawa, JP;
Tomio Nakajima, Nakatsugawa, JP;
Kiyotaka Ida, Nakatsugawa, JP;
Masahiko Sameshima, Settsu, JP;
Yoshiyuki Kobayashi, Nara, JP;
Kenji Yamaguchi, Osaka, JP;
Iwao Nohara, Nakatsugawa, JP;
Tomio Nakajima, Nakatsugawa, JP;
Kiyotaka Ida, Nakatsugawa, JP;
Masahiko Sameshima, Settsu, JP;
Yoshiyuki Kobayashi, Nara, JP;
Kenji Yamaguchi, Osaka, JP;
Daisen Industry Co., Ltd., Nakatsugawa, JP;
Kaneka Corporation, Osaka, JP;
Abstract
A die-expanded molding apparatus comprising starting material bead supply for supplying beads on a current of air from a tank through a packer into a cavity formed by a core and cavity molds; a plurality of air expulsion devices having air pressure-adjusting components communicating with the cavity, a dual-system air expulsion device being such that steam chambers on the back side of the core mold and the cavity mold are used as the air pressure-adjusting components, each communicating with the cavity through through-holes formed in the core and cavity molds, respectively; an air expulsion device having one or more air pressure-adjusting components communicating with a clearance between the core and cavity molds; and a control for controlling the air pressure in each of the air pressure-adjusting components to be pressurized less than the pressure in the tank.