The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2006
Filed:
Oct. 02, 2002
Lakshman Rathnam, Mountain View, CA (US);
Edmond Lau, Sunnyvale, CA (US);
Pierre Mertz, Sunnyvale, CA (US);
Albert T. Yuen, Palo Alto, CA (US);
Howard Huang, Santa Clara, CA (US);
Lakshman Rathnam, Mountain View, CA (US);
Edmond Lau, Sunnyvale, CA (US);
Pierre Mertz, Sunnyvale, CA (US);
Albert T. Yuen, Palo Alto, CA (US);
Howard Huang, Santa Clara, CA (US);
Emcore Corporation, Somerset, NJ (US);
Abstract
A flexible printed circuit board (FPCB) for fiber optic modules includes a board with multiple bends, forming a structure with sides and a bottom. The traces in the FPCB traverse from the opto-electronic chips, through the sides of the FPCB, to the module interconnects at the bottom. The multi-fold structure allows the FPCB to support a higher number of traces than conventional single-fold FPCB's, and it allows the fanning out of signal traces from the opto-electronic and electronic chips at the front of the fiber-optic module, thereby reducing the crosstalk between the traces. This higher number is provided with a FPCB that features a single insulating layer and without the need to criss-cross the traces, resulting in improved signal integrity over conventional multi-layer FPCB's.