The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2006

Filed:

Apr. 25, 2003
Applicants:

Ren-haur Hwang, Taoyuan, TW;

Der-yang Liu, Taoyuan, TW;

Chen-ron Lin, Hsinchu, TW;

Inventors:

Ren-Haur Hwang, Taoyuan, TW;

Der-Yang Liu, Taoyuan, TW;

Chen-Ron Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01C 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal. Finally, a thermal-laminating process is performed to laminate a polymeric composite material on the composite electroplating layer to form the composite materials of the positive temperature coefficient thermistor device, wherein the polymeric composite material is conductive crystallized and filled with the carbon black.


Find Patent Forward Citations

Loading…